Caso de pieza · Metal 3D Printing
Kit de bisagra para móvil plegable AM
Exhibition kit of slender titanium-class hinge mechanisms and a stainless hinge cover — for discussing micro AM envelopes, layer thickness class, and which faces need secondary finish; not an OEM product listing.
Especificación típica
| Item | Typical value |
|---|---|
| Process | High-resolution metal AM |
| Material | Ti or stainless alloy |
| Form | Hinge mechanism strips + cover blank |
| Scale | Thin, long consumer-electronics parts |
| Post | Optional polish / face finish |
Micro-hinge mindset
Long thin hinge blanks need clear minimum thickness, powder-clear paths, and a plan for measuring flatness.
- State which faces are touch/cosmetic versus structural
- Do not invent cycle-life or micron capability numbers on this page
RFQ checklist
Alloy, target envelope class, flatness of working faces, and any cleanliness requirements you need stated. Do not name OEM phone brands as customers on this page.
Siguiente paso
¿Tiene una pieza similar?
Cargue su CAD y sus planos. Un ingeniero revisa los materiales, las tolerancias y el acabado antes de cotizar.