Caso de pieza · Metal 3D Printing
Juego de placas frías TPMS de cobre AM
Four pure-copper cold-plate samples with different minimal-surface / lattice channel styles on square bases — for comparing channel topologies in copper AM thermal hardware; parameters are illustrative only.
Especificación típica
Valores clave
| Item | Typical value |
|---|---|
| Process | Copper powder-bed fusion |
| Material | Pure copper |
| Form | Cold-plate samples, multiple channel styles |
| Channels | TPMS / lattice / fin variants |
| Post | Powder flush; optional face mill |
Why show a set
Different minimal-surface and fin styles change powder removal difficulty and sealing-face machining even when the outer envelope looks similar.
| Style focus | What to ask on the RFQ |
|---|---|
| Gyroid / TPMS | Escape holes and flush direction |
| Dense lattice | Minimum strut thickness and inspection |
| Fine fins | Which faces must be sealed flat |
Honesty bar
No chip thermal-resistance numbers, no customer chip brands, and no invented flow rates on this page.
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